Fujitsu Laboratories has created a thin flexible adhesive sheet thermal interface material for heatsinking that achieves up to 100W/mK thermal conductivity. “Unlike previous technologies, the carbon nanotube adhesive sheets are also flexible, making them easy to cut and handle for use on variety of surfaces,” according to the lab. “This technology promises to deliver practical improvements and ...

This story continues at Nanotube’s cut thermal resistance of heatsink interface

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