Marvell has demo-ed silicon interconnects produced on TSMC’s 3nm process. Marvell’s 3nm silicon building blocks include 112G XSR SerDes Long Reach SerDes, PCIe Gen 6 / CXL 3.0 SerDes, and a 240 Tbps parallel die-to-die interconnect. These technologies also support all semiconductor packaging options from standard and low-cost RDL (Redistribution Layers) to silicon-based high-density interconnect. ...

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